Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys

Name: Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys
Brand: Springer Nature
SKU: 9781461502555
Availability: InStock

Best Price (Coupon Required):
Buy Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys for $134.10 at @ Link.springer.com when you apply the 10% OFF coupon at checkout.
Click “Get Coupon & Buy” to copy the code and unlock the deal.

Set a price drop alert to never miss an offer.

1 Offer Price Range: $149.00 - $149.00

BEST PRICE

Single Product Purchase

$134.10

@ Link.springer.com with extra coupon

Price Comparison

Seller	Contact Seller	List Price	On Sale	Shipping	Best Promo	Final Price	Volume Discount	Financing	Availability	Seller's Page
BEST PRICE 1 Product Purchase @ Link.springer.com		$149.00	$149.00		10% OFF This deals requires coupon	$134.10		See Site	In stock	Visit Store

Product Details

Brand

Springer Nature

Manufacturer

N/A

Part Number

GTIN

9781461502555

Condition

New

Product Description

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

Available Colors

N/A

Available Sizes

N/A