Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Name: Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Brand: Springer Nature
SKU: 9783319778716
Availability: InStock

Best Price:
Buy Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering for $119.00 at @ Link.springer.com
No coupon is required — this is the standard retail price.

Set a price drop alert to never miss an offer.

1 Offer Price Range: $119.00 - $119.00

BEST PRICE

Single Product Purchase

$119.00

@ Link.springer.com BUY Now

Price Comparison

Seller	Contact Seller	List Price	On Sale	Shipping	Best Promo	Final Price	Volume Discount	Financing	Availability	Seller's Page
BEST PRICE 1 Product Purchase @ Link.springer.com		$119.00	$119.00			$119.00		See Site	In stock	Visit Store

Product Details

Brand

Springer Nature

Manufacturer

N/A

Part Number

GTIN

9783319778716

Condition

New

Product Description

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the loaddisplacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

Available Colors

N/A

Available Sizes

N/A