Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packag
Best Price (Coupon Required):
Buy Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packag for $386.10 at @ Link.springer.com when you apply the 10% OFF coupon at checkout.
Click “Get Coupon & Buy” to copy the code and unlock the deal.
Set a price drop alert to never miss an offer.
Single Product Purchase
Price Comparison
Seller | Contact Seller | List Price | On Sale | Shipping | Best Promo | Final Price | Volume Discount | Financing | Availability | Seller's Page |
---|---|---|---|---|---|---|---|---|---|---|
BEST PRICE 1 Product Purchase
|
|
$429.00 | $429.00 |
|
10% OFF
This deals requires coupon
|
$386.10 | See Site | In stock | Visit Store |
Product Details
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions. Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.