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Three-Dimensional Integration of Semiconductors
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Product Details
This book starts with backgroundconcerning three-dimensional integration - including theirlow energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.The book covers numerous applications, includingnext generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
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