Wafer Bonding
Wafer Bonding
Brand
Springer Nature
Manufacturer
N/A
Part Number
0
GTIN
9783540210498
Condition
New
Product Description
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Available Colors
Available Sizes
1 Offer
Price Range: $299.00 - $299.00
Price Comparison
Seller | Contact Seller | List Price | On Sale | Shipping | Best Promo | Final Price | Volume Discount | Financing | Availability | Seller's Page |
---|---|---|---|---|---|---|---|---|---|---|
BEST PRICE 1 Product Purchase
|
$299.00 | $299.00 |
|
$299.00 | See Site | In stock | Visit Store |