Arbitrary Modeling of TSVs for 3D Integrated Circuits
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Brand
Springer Nature
Manufacturer
N/A
Part Number
0
GTIN
9783319076102
Condition
New
Product Description
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductorand inductive-based communication system and bandpass filtering.
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